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Thermal Conductivity 0.085 W/MK Glass Hollow Microspheres Enhance Shield

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Thermal Conductivity 0.085 W/MK Glass Hollow Microspheres Enhance Shield

Brand Name : HAINUO

Model Number : HN25HS

Place of Origin : SHANXI CHINA

Surface Area : High

Density : 0.15-1.0 G/cm³

True Density : 0.244-0.256

Diameter : 25-85µm

Porosity : High

Particle Surface Area : High

Bulk Density : 0.12-0.15

Dielectric Constant : 1.2-2.2(100MHZ)

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High Surface Area Hollow Microspheres with True Density 0.244-0.256 & Particle Surface Area

Product Description:

Hollow Microspheres are lightweight and highly efficient microspheres with a diameter of 25-85µm. These microspheres are made of inorganic compounds and provide a high surface area. Hollow Microspheres are widely used in construction, rubber, aerospace adhesives and boyancy materials due to their low bulk density of 0.12-0.15. They are also used to protect aircrafts during flight, as they allow efficient heat transfer and prevent deformation.

Features:

  • Hollow Microspheres:True Density: 0.244-0.256, Bulk Density: 0.12-0.15, Dielectric Constant: 1.2-2.2(100MHZ), High Surface Area, High Particle Surface Area.
  • Ideal for aviation, protection systems, to improve flameproof and improve abrasion resistance.

Technical Parameters:

Parameters Value
Bulk Density 0.12-0.15 g/cm³
Application Construction, Rubber, Aerospace Adhesives, Boyancy Materials.
Density 0.15-1.0 g/cm³
True Density 0.244-0.256 g/cm³
Thermal Condictivity 0.085 W/mK
Surface Area High
Diameter 25-85µm
Particle Surface Area High
Dielectric Constant 1.2-2.2(100MHZ)
Porosity High
Key Features Enhance Shield, Improve Corrosion Resistance, Efficient Heat Transfer

Applications:

Hainuo HN25HS Hollow Microspheres are an ideal choice for a variety of applications because of their unique properties. With a bulk density of 0.12-0.15, these microspheres have a high surface area and porosity, providing excellent thermal conductivity of 0.085. This makes them ideal for use in construction, rubber, and aerospace adhesives as well as buoyancy materials.

Because of their low density, Hainuo HN25HS Hollow Microspheres are able to reduce mechanical stress and enhance shield in aviation applications. This is essential for the safety of passengers and crew alike. Additionally, due to their low density, they can also help reduce weight in aircraft design.

These unique properties make Hainuo HN25HS Hollow Microspheres an ideal choice for a variety of applications. They are perfect for use in construction, rubber, and aerospace adhesives, and are also great for buoyancy materials. With their superior thermal conductivity and low density, they are an excellent choice for aviation and other applications where light weight and superior shielding are needed.

Support and Services:

Hollow Microspheres Technical Support and Service

We offer comprehensive technical support and service for Hollow Microspheres to ensure that you get the most out of your product. Our technical support team is available to answer any questions you may have.

We also provide a range of services, such as customization, optimization, and troubleshooting. Our team of experts can help you get the most out of your product and make sure it meets your needs.

If you have any questions or need assistance, please don't hesitate to contact us. We are here to help!

FAQ:

Hollow Microspheres
Q: What is the Brand Name of the Hollow Microspheres?
A: The Brand Name of the Hollow Microspheres is HAINUO.
Q: What is the Model Number of the Hollow Microspheres?
A: The Model Number of the Hollow Microspheres is HN25HS.
Q: Where is the Place of Origin of the Hollow Microspheres?
A: The Place of Origin of the Hollow Microspheres is SHANXI CHINA.
Q: What are the features of Hollow Microspheres?
A: The features of Hollow Microspheres include low bulk density, low thermal conductivity, and low water absorption.
Q: What are the applications of Hollow Microspheres?
A: The applications of Hollow Microspheres include insulation materials, light wall filler, fillers for paints and coatings, and fillers for ink.

Product Tags:

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Quality Thermal Conductivity 0.085 W/MK Glass Hollow Microspheres Enhance Shield for sale

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